Rogers Ceramic PCB Laminate Selection Guide

In the construction of ceramic PCB, there is a wide range of substrate materials available, including Al2O3, AlN, ZrO2, Ga2O3, and sapphire. However, it is important to consider the properties of these materials as they can be excessively pure, leading to issues with hardness and brittleness, particularly in multilayer ceramic PCB. Nevertheless, with the ongoing trend towards miniaturization, the electronic manufacturing industry is increasingly in need of multi-layer circuit structures. To address this requirement, the Rogers 4000® series substrates offer valuable solutions by facilitating easier construction of multi-layered circuits, these boards, are known as Rogers Ceramic PCB. Now to explore the remarkable capabilities of Rogers ceramic substrates and gain insights on selecting the appropriate materials for your needs.

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RO4000® LoPro®

RO4000® LoPro® is a composite ceramic laminate material developed by Rogers Corporation using their proprietary technology. It offers unique advantages when combined with the standard RO4000 series materials by utilizing an inverted copper foil configuration. This innovative design reduces conductor loss, improves insertion loss, and enhances signal integrity within the laminate, while retaining all the benefits of the standard RO4000 laminate system.

This ceramic hydrocarbon laminate is specifically engineered for exceptional high-frequency performance. What sets it apart from other Rogers laminates is its compatibility with standard epoxy/glass (FR-4) processes, eliminating the need for specialized preparation procedures and thus reducing manufacturing costs. The resulting Rogers ceramic PCB, fabricated with this material, exhibits reduced insertion loss, enables higher frequency designs (over 40 GHz), mitigates passive intermodulation (PIM) in base station antennas, and minimizes conductor loss while enhancing the circuit’s thermal performance.

ParameterValue
Dielectric Constant2.55 – 3.38
Loss Tangent0.002 – 0.004
Temperature Coefficient of Dielectric Constant23 ppm/°C
Flexural Strength240 MPa
Coefficient of Thermal Expansion14 – 16 ppm/°C
Dimensional Stability±0.05%
Thermal Conductivity0.97 W/m·K
Moisture Absorption<0.10%

RO4003C™

RO4003C is an advanced laminate that integrates the benefits of glass cloth reinforcement and ceramic filling in hydrocarbon composites with the electrical properties of PTFE/glass cloth and the processability of epoxy/glass. This innovative material presents compelling opportunities for multi-layer board (MLB) construction, offering comparable performance to conventional microwave laminates but at a significantly reduced cost. It is important to note, however, that RO4003C Ceramic PCB is a non-brominated material and does not meet the UL 94 V-0 flammability standard, which should be taken into consideration for applications with specific fire safety requirements.

ParameterValue
Dielectric Constant3.38
Loss Tangent0.0027
Temperature Coefficient of Dielectric Constant15 ppm/°C
Flexural Strength345 MPa
Coefficient of Thermal Expansion14 ppm/°C
Dimensional Stability±0.1%
Thermal Conductivity0.5 W/m·K
Moisture Absorption<0.04%

RO4350B™

RO4350B ceramic laminates offer precise control over the dielectric constant with minimal losses, while maintaining compatibility with standard FR4 material processing methods. This ensures seamless integration and familiarity throughout the entire manufacturing process. Additionally, RO4350B exhibits exceptional dimensional stability, making it an optimal choice for applications requiring microwave.

ParameterValue
Dielectric Constant3.48
Loss Tangent0.0035
Temperature Coefficient of Dielectric Constant13 ppm/°C
Flexural Strength345 MPa
Coefficient of Thermal Expansion12 ppm/°C
Dimensional Stability±0.04%
Thermal Conductivity0.8 W/m·K
Moisture Absorption<0.1%

RO4360G2™

The distinguishing feature of utilizing RO4360G2 in Rogers ceramic-based PCB lies in its capability to deliver high Dk values within the thermoset laminate category, while simultaneously offering a processing approach akin to FR4 materials, thereby streamlining the manufacturing process. Moreover, RO4360G2 can be seamlessly integrated with RO4400™ series prepregs and lower dielectric constant RO4000® laminates, enabling extensive possibilities for multifunctional multilayer designs.

By employing this laminate, additional advantages are gained in the assembly process, including automatic assembly, high reliability plated through holes, environmental compatibility, compatibility with lead-free processes, efficient supply chain management, and shorter lead times. 

ParameterValue
Dielectric Constant6.15
Loss Tangent0.002
Temperature Coefficient of Dielectric Constant14 ppm/°C
Flexural Strength586 MPa
Coefficient of Thermal Expansion13 ppm/°C
Dimensional Stability±0.04%
Thermal Conductivity0.68 W/m·K
Moisture Absorption<0.05%

RO4500™

The RO4500 employs a resin system with inherent properties that significantly enhance antenna performance optimization. Its closely matched CTE to that of copper mitigates issues related to PIM, thereby rendering ceramic PCB ideal for antenna applications. This combination of cost-effectiveness and high-performance attributes ensures optimal results.

ParameterValue
Dielectric Constant6.15
Loss Tangent0.003
Temperature Coefficient of Dielectric Constant15 ppm/°C
Flexural Strength552 MPa
Coefficient of Thermal Expansion15 ppm/°C
Dimensional Stability±0.04%
Thermal Conductivity0.93 W/m·K
Moisture Absorption<0.1%

RO4700™

RO4700 is an antenna-grade laminate, providing a highly viable substitute for conventional PTFE laminates. Crafted by Rogers, this ceramic circuit board is engineered to seamlessly integrate with high-temperature lead-free soldering processes, eliminating the need for any specialized handling typically associated with traditional approaches.

ParameterValue
Dielectric Constant4.3
Loss Tangent0.003
Temperature Coefficient of Dielectric Constant16 ppm/°C
Flexural Strength400 MPa
Coefficient of Thermal Expansion14 ppm/°C
Dimensional Stability±0.04%
Thermal Conductivity0.75 W/m·K
Moisture Absorption<0.1%

RO4835IND™ LoPro®

The RO4835IND LoPro laminate is meticulously engineered to cater to the exacting demands of short-range industrial radar applications spanning the frequency range of 60 to 81 GHz. By employing this laminate as a ceramic PCB substrate material, designers can unlock unparalleled electrical performance, RF performance, and stability, thereby ensuring seamless signal transmission even in the challenging high-frequency millimeter wave (mmWave) frequency band.

ParameterValue
Dielectric Constant3.5
Loss Tangent0.0027
Temperature Coefficient of Dielectric Constant19 ppm/°C
Flexural Strength355 MPa
Coefficient of Thermal Expansion10 ppm/°C
Dimensional Stability±0.1%
Thermal Conductivity0.5 W/m·K
Moisture Absorption<0.04%
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