What is Via in PCB

Multiple sections collectively form an entirety within a printed circuit board, encompassing the use of various types of vias. These vias serve a pivotal role in electrical connectivity and fixation, necessitating the implementation of all essential measures to enhance circuit performance during design. In this article, TechSparks will offer a more comprehensive guide to the circuit boards via, aiding in the design of your project.

circuit board via

Understanding PCB Via and Their Types

What is a Via in PCB

Via in a PCB are diminutive conductive conduits that establish connections between distinct layers of the circuit board. Manifesting as cylindrical apertures, these vias are infused with a metal, commonly copper, to establish electrical pathways that interlink traces on separate strata. This interconnectedness enables the seamless transmission of current and signals between components, thereby substantiating the optimal performance and integrity of the electronic circuitry.

Different Types of Vias in PCB

Different types of VIAS

Through-Hole Via: Extends through the entire circuit board to provide a solid connection between the top and bottom layers, and includes both plated through hole and Non-plated through hole.

Two kinds of Through-Hole Vias

Blind Via: Establishes a connection between the outer and inner layers without traversing the entirety of the board. It’s important to clarify that blind vias are not exclusively indicative of HDI PCB; HDI PCB may incorporate blind vias, but blind vias are not an exclusive hallmark of HDI PCB.

Blind hole in via

Buried Via: A via that exists in multilayer PCB, is confined within inner layers, enhancing PCB density without external visibility.

Buried vias for multilayer circuits

MicroVias: Small vias used in HDI PCB for fine-pitch component routing and miniaturization.

Microvias in High Frequency Circuits

Impact of Via on PCB Electrical Performance

Signal Transmission Characteristics

Via Inductance and Capacitance

Vias inherently manifest inductance and capacitance attributed to their geometric configuration and spatial disposition within the PCB. Inductance introduces the potential for signal reflections and the deceleration of signal rise times, while capacitance exert influence over signal propagation velocity. The prominence of these attributes escalates notably as frequencies ascend, thereby exerting discernible repercussions on signal integrity.

Impacts on Signal Integrity and Delay

The matter of signal delay stemming from vias assumes pivotal import, particularly within the ambit of high-speed design paradigms, where discrepancies in propagation duration can instigate timing intricacies.

Impedance Control and Differential Pair Routing

Safeguarding signal integrity and obviating impedance disparities necessitates vigilant management of via impedance. Differential pair routing encompasses the imperative task of guaranteeing that paired signals encounter symmetrical and opposing impacts from vias, thereby upholding equilibrium in transmission and curtailing common-mode noise.

Crosstalk and EMI Mitigation Techniques

Vias have the potential to induce crosstalk, a phenomenon in which signals intersect and generate undesired noise and signal distortion. Effective management of crosstalk effects can be achieved through meticulous consideration of trace spacing and strategic via positioning. Furthermore, vias can assume the role of antennas, EMI, or being vulnerable to EMI originating from external sources. Prudent PCB layout strategies, encompassing shielding measures and judicious grounding practices, constitute vital measures for attenuating challenges related to EMI.

HDI PCB and Microvias

Microvia Structure and Fabrication

Microvias, employed in High-Density Interconnect PCB, encompass diminutive diameter apertures that facilitate interconnections between diverse layers.

The microvia structure is characterized by three primary constituents: the copper-infused via barrel, the encapsulating dielectric material, and the conductive surface pad atop it.

Microvias can be actualized through either laser drilling or mechanical drilling methodologies. Laser drilling is the prevailing choice for HDI PCB, favored for its precision and adeptness in generating minutely sized vias. The diameter of microvias typically spans the range of 50 to 150 microns, and occasionally even smaller, contingent upon the stipulations of the PCB design.

Sequential Build-Up and Staggered Via

Staggered vias are microvias that start on one layer but do not fully penetrate through the entire PCB. Instead, they stop on an inner layer, and a new microvia starts from that layer to reach the next layer, creating a staggered effect. This allows for more routing channels and better use of available space in the PCB.

Via-in-Pad Solutions for BGA Components

Ball Grid Array (BGA) components incorporate solder balls underneath them for surface mounting. Via-in-pad (VIP) represents an approach deployed in HDI circuit board, entailing the placement of microvias directly within the solder pad of the BGA component. VIP solutions furnish a more condensed layout, diminish the separation between the BGA pads and their corresponding vias, and elevate the thermal efficiency of the BGA component.

Via Reliability and Failure Modes

Thermal Stress and Fatigue

Thermal stress and fatigue constitute substantial considerations for vias within PCB, particularly within high-power or elevated-temperature contexts. During fluctuations in temperature, vias can exhibit expansion and contraction rates distinct from the encompassing materials, thereby incurring thermal stress. Over prolonged periods, these recurrent stresses can precipitate fatigue and ultimately culminate in via malfunction.


A prevalent approach for assessing thermal stress in vias entails the utilization of the coefficient of thermal expansion (CTE) for the pertinent materials. The formula employed for computing thermal stress attributed to temperature fluctuations (∆T) is as follows:

Thermal Stress = ∆T * CTE

Pad Cratering and Plating Cracks

Pad cratering and plating cracks represent two prevalent failure modes observed in PCB vias, frequently induced by mechanical stress during various stages of manufacturing, assembly, or operational usage. Pad cratering pertains to the emergence of cracks and voids within the PCB pads, a consequence of excessive mechanical loading. Conversely, plating cracks manifest within the conductive plating encasing the vias.

Conductivity Issues and Open Via

Conductivity-related issues can emerge within vias due to subpar plating quality, potentially leading to elevated resistance or the occurrence of open vias. Open vias denote vias lacking electrical continuity, and their presence disrupts the seamless signal propagation between distinct layers of the PCB.


The process of determining the conductivity of a via entails the consideration of its dimensions (diameter and length) alongside the resistivity of the plating material. The formula utilized for calculating the resistance (R) of a cylindrical via is as follows:

  • R = (ρ * L) / (π * r^2)


  • ρ = Resistivity of the plating material (measured in Ohmmeters)
  • L = Length of the via (expressed in meters)
  • r = Radius of the via (measured in meters)

By performing the resistance calculation, it becomes feasible to ascertain whether the via aligns with the mandated electrical specifications. Reduced resistance values signify enhanced conductivity and a diminished likelihood of encountering open vias.

Industry Standards and Guidelines


This standard encompasses a range of via types, encompassing through-hole, blind via, and buried via.

IPC-2226 covers several aspects of PCB via design rules, including via aspect ratios, requisites for pad and hole sizes, thermal considerations, impedance regulation, and the design of anti-pads. Furthermore, it addresses design considerations pertinent to high-speed applications, including controlled impedance and the preservation of signal integrity.

ISO and NEMA Standards

While these standards may not exclusively center on vias, they furnish comprehensive directives encompassing PCB manufacturing processes, material specifications, and overarching design considerations.

ISO standards pertaining to PCB encompass a diverse array of facets, spanning design principles, material selection, SMT technology, and methodologies for testing. Often, these standards offer invaluable insights that, although not directly addressing via design, can exert an indirect influence, such as offering counsel on material compatibility and thermal management.

More content you may be interested in

tented vias
Tented Vias in PCB

The article emphasizes the significance of tenting PCB vias to shield them from external factors, enhancing signal integrity and assembly processes, particularly in high-speed and

buried via hole
What Are Buried Vias in PCB and Their Purpose

Buried vias enhance signal efficiency in multilayer PCBs, crucial for high-density interconnects. Despite added costs, they play a vital role in advanced electronic devices, optimizing

blind vias in pcb
PCB Blind Via Tutorial

Blind vias revolutionize PCB design, offering precise interlayer connections without spanning the entire board. Their benefits include suitability for miniaturized designs and compatibility with advanced

pcb pad
PCB Pad Fundamentals

PCB pads, essential for electronic connectivity, serve as connection points and aid heat dissipation. Through-hole pads suit pin insertion, while surface mount pads are for

PCB Solder Mask Opening
Guide to PCB Solder Mask Opening Design

PCB solder mask openings are crucial for various applications, including test points, heat dissipation, grounding, gold fingers, and current capacity enhancement. Design considerations, like choosing

pcb ground plane
Optimal Practices for PCB Ground Plane Design

This guide on PCB ground planes covers essential aspects for ensuring circuit stability and performance. It explores ground plane nodes, grounding schemes, and effective techniques.

Scroll to Top