What is DIP IC chip packaging?

Undoubtedly, since you’ve already searched to learn about DIP, it implies that you have gained some understanding of integrated circuits. An integrated circuit is a highly integrated component that tightly incorporates multiple electronic components within a silicon chip, achieving multifunctionality and miniaturization. A closely related concept is IC packaging. Packaging is the process of enclosing a manufactured microchip along with its associated connecting lines, protective materials, etc., within an outer casing. Its purpose is to safeguard the chip from physical damage and environmental impacts, while also facilitating the chip’s connection to circuit boards or other systems. In the current technological environment, various types of integrated circuit packaging exist, among which one venerable and common type is the DIP packaging. In this article, TechSparks will provide you with guidance on DIP packaging, aiming to help you better comprehend this form of packaging.

dip package

What is DIP Package?

In microelectronics, full name of DIP is Dual In-line Package, also known as DIL. It’s a classic pin package characterized by a rectangular casing and two rows of pins for electrical connections. These pins are inserted into holes on a printed circuit board and then soldered to create robust solder joints.

The origins of DIP technology can be traced back to the 1960s when Don Forbes, Rex Rice, and Bryant Rogers jointly developed it to address the limitations of round transistor-style packaging pins. However, as demands changed, the variety of packaging forms expanded, leading to reduced usage of DIP IC packaging. It was gradually replaced by SMD, BGA, QFN, and more. Nowadays, DIP is primarily employed for legacy equipment maintenance, education, academic research, and frequent component replacements in prototype production.

Today, when using DIP components in your projects, you’ll encounter various variants, like DIPn, where n represents the total number of pins, such as DIP-4, DIP-8, DIP-14, DIP-16, and even 100+. The choice of variant depends mainly on the chip or component’s functionality and complexity. Additionally, DIP pin pitch is a crucial consideration in packaging design, with options like 0.5mm, 0.65mm, 1.27mm, 2.54mm, and so on.

Features of DIP Chip Packaging


  • This packaging form involves directly inserting components into the circuit board, providing enhanced mechanical strength to withstand mechanical stress or vibrations in projects.
  • The larger size of DIP components simplifies manual assembly, thus accelerating small-batch production or prototype creation.
  • Being a traditional packaging technology, DIP is often mature and cost-effective, with its straightforward assembly process further reducing costs.
  • Despite its lower usage rate, DIP remains widely employed across various fields in the electronics industry.
  • In DIP packaging design, pins are linearly arranged on the exterior, making repairs, replacements, or re-soldering easier in case of malfunctions.
  • With their direct connection to the circuit board, these components have better mechanical strength to cope with mechanical stress or vibrations in projects.
  • Despite its lower usage rate, DIP remains widely employed across various fields in the electronics industry.


  • The large size implies a larger footprint on the board, necessitating larger hole sizes and lead spacing, which limits the board’s compactness and flexibility, a primary drawback.
  • The PCB assembly process requires specialized equipment for automation, which not all factories possess. This implies the need to find more specialized PCBA manufacturers.
  • DIP components may generate parasitic capacitance and inductance, restricting their performance at high frequencies.
  • As the industry shifts towards SMT technology, sourcing certain components becomes difficult, leading to challenges in disposal.
  • The use of leaded solder may be involved, potentially leading to health issues and environmental pollution, not compliant with RoHS directives.
  • Due to limited contact area, heat transfer to the circuit board is constrained, and lacking in heat dissipation structures compared to BGAs, often unsuitable for high-temperature projects.
  • The holes on the board may limit wiring options and complicate the creation of complex multilayer board designs.

DIP Package Comparison

Different Types of DIP Packages

Different types of DIP packaging exist based on material or size:

  • PDIP: The most common and affordable DIP packaging type, employing plastic as the main material. Suitable for a range of integrated circuits.
  • SDIP: A skinny dual in-line package designed to overcome DIP’s size limitations, suitable for densely packed circuit board layouts.
  • CerDIP: This packaging uses ceramics instead of plastic, offering high-frequency capabilities and corrosion resistance. There’s single-layer CerDIP (SC CerDIP) and multi-layer CerDIP (MC CerDIP).
  • CerDIP Side Brazed: An enhanced version of the traditional dual in-line package, utilizing side brazing for improved heat dissipation compared to bottom soldering.
  • Hybrid DIP: A type constructed using a combination of metals and other materials.

When choosing different packaging types, it’s crucial to clearly understand your project’s specific requirements, whether they involve cost-effectiveness, high-frequency performance, microcircuitry, or other considerations.

Other Packages vs DIP

Full NameDual In-line PackageSurface Mount DeviceBall Grid ArrayQuad Flat PackageThin Small Outline PackageLand Grid Array
Pin Count8-40VariableVariableVariableVariableVariable
Assembly MethodTHT AssemblySMT AssemblySMT AssemblySMT AssemblySMT AssemblySMT Assembly
Component DensityLowHighVery HighHighMediumHigh
Thermal PerformanceModerateModerateExcellentGoodGoodExcellent
Manufacturing ComplexityLowModerateHighModerateModerateHigh
Package VolumeLargeSmallSmallMediumSmallMedium
Pin PitchStandardCompactCompactStandardCompactCompact
I/O DensityLowHighHighMediumHighHigh
Signal IntegrityModerateModerateExcellentGoodGoodExcellent

How to Use DIP Components

During the initial stages, engineers need to use CAD software for layout design and configure component placement paths and hole positions. These holes are used for inserting the pins. Once the layout is completed and a through-hole PCB is manufactured, it needs to be assembled into a complete PCBA board. Firstly, solder pads and leads should be wiped with flux to remove oxides and contaminants, ensuring good solder wetting and adhesion. Next, insert the DIP component pins into the holes, extending to the other side of the board. Pay attention to the insertion force to avoid pin damage, and after insertion, ensure uniformity in component orientation, position, and height. Subsequently, the PCB soldering process is undertaken, involving the use of a high-temperature soldering iron; caution and protective measures are crucial to prevent harm. Finally, after completing all steps, perform inspections to ensure accuracy and quality.

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