CerDIP, also known as CDIP, represents a dual in-line package characterized by its employment of ceramics instead of traditional plastic. This ceramic-based approach ensures airtight sealing, effectively barring the entry of moisture and contaminants, while enhancing thermal properties. It’s important to be aware that despite the ceramic composition of the packaging, the sockets themselves are still made of plastic. While these plastic sockets do not impact electrical performance, they may be susceptible to damage due to temperature concerns. Ceramic DIP packages address this concern by safeguarding semiconductor junction temperatures, which can incur harm at levels far lower than those compromising the plastic encasing of sockets.
CerDIP configurations consist of a cap upper section and a base lower section. The integration involves gold-plated leads that establish connections via soldering to the sides, coupled with a metal cap affixed to the chip through a metal seal. A microchip mounting cavity is embedded within the base. The base is enveloped by a lid, which, in turn, is sealed using fused sealing glass. The resulting hermetic glass seal, formed once cooling and solidification occur, underpins the utilization of hermetic packages like CerDIP in applications like medical-grade equipment.
CerDIP has the same high-performance attributes found in standard three-layer ceramic packaging, while presenting an economically viable alternative. Holding military certification, this package excels in reliability features. The lid and base stem from a singular pressing of 92% aluminum oxide (Al2O3). Typically, the base incorporates a lead frame securely embedded within solder glass. Diverse pin counts and package sizes are available.
The pin count of this DIP package ranges from 8 to 40, offering both narrow and wide configurations, with lead spacing hovering around 100 mils.